Microvia PCB Cost Estimator

Budget range for HDI builds by layer count, via structure and volume.

Cost Estimate - Blind microvia landing on the layer-2 capture pad — Blind microvia landing on the layer-2 capture pad

Cost Estimate - Staggered microvia transition across build-up layers — Staggered microvia transition across build-up layers

Cost Estimate - Stacked microvia column through three build-up layers — Stacked microvia column through three build-up layers

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Design rule quick check

Laser via diameter (um) Capture pad diameter (um) Dielectric thickness (um)

Early budget estimate

Layer count Via structure Quantity (pcs)